2024-04 RWP-MIC-24-01 Microelectronics

Due: April 26, 2024

The DoD’s Advanced PCBs and Electronic Substrates initiative is to invest in prototype projects across key strategic areas to bolster high-mix, low-volume domestic capabilities. Proposed solutions must be at least a technology readiness level (TRL) 6 and/or a manufacturing readiness level (MRL) of 5. Enhanced White Papers should align within one or more of the following technical requirement areas:

  • MIC-24-001: domestic complex printed circuit board (High Density Interconnect [HDI] and/or organic Integrated Circuit (IC) substrate) construction and production capability and capacity;
  • MIC-24-002: domestic sourcing for enabling manufacturing materials;
  • MIC-24-003: improved microvia reliability; and
  • MIC-24-004: high-density interconnect reliability data.

This opportunity requires membership in the Defense Industrial Base Consortium (DIBC). This Consortium releases numerous opportunities throughout the year, so even if this one may not be right for you, we strongly encourage you to join the consortium, so you are ready for the next opportunity. 

Complete the form below and a program representative will reach out to you shortly to support you through the process.

Contact DIBC: RWP-MIC-24-01 Microelectronics